LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: An LED package and a manufacturing method thereof are provided to form a light irradiation surface pattern part on the surface of a hardened resin layer, thereby maximizing light extraction efficiency. CONSTITUTION: A package body(50) comprises a cavity in which a resin layer(20) is formed. An LED chip is mounted in the package body. A body pattern part(40) is placed on the package body. A light irradiation surface pattern part(60) is formed on the surface of the resin layer. A lens unit(70) increases the directional angle of light.