THERMOSET RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A thermosetting resin composition is provided to enable the hardening at low temperature, to improve heat resistance and mechanical strength, and to embody a substrate having low dielectric property. CONSTITUTION: A thermosetting resin composition comprises substituted or unsubstituted polyfunctional acrylic compounds and liquid crystalline oligomers or polymers represented by chemical formula 4. In chemical formula 4, B^1 and B^2 are represented by chemical formula 5; D^1 and D^2 are thermosetting crsslinking reactive groups; and k^1 and k^2 independently an integer of 0-50, wherein at least one of k^1 and k^2 is an integer of 1-50.