发明名称 |
Light emitting device, package and lead frame |
摘要 |
The semiconductor device includes a semiconductor element, a lead frame electrically connected to the semiconductor element, and a package having an opening in a front surface with a part of the lead frame protruding from a bottom surface. The protruding lead frame branches into a plurality of end portions, and the end portions are bent to be positioned respectively on a side surface and one of a back surface and a bottom surface of the package. |
申请公布号 |
US7982235(B2) |
申请公布日期 |
2011.07.19 |
申请号 |
US20080024344 |
申请日期 |
2008.02.01 |
申请人 |
NICHIA CORPORATION |
发明人 |
ASAKAWA HIDEO;KURIMOTO TAKEO |
分类号 |
H01L33/00;H01L33/56;H01L23/48;H01L23/52;H01L29/40;H01L33/62;H01L33/64 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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