| 摘要 |
PURPOSE: A substrate cleaning device is provided to directly input a chucking device for chucking a substrate into a processing chamber without a separate inversion device, thereby cleaning both the front side and the rear side of the substrate. CONSTITUTION: A chucking device(200) is arranged in a processing chamber(100). The chucking device chucks a substrate(W). A spray device cleans the substrate by spraying cleaning liquid onto the substrate. A locking bar(400) penetrates the side of the processing chamber. An inversion device(600) is connected to the locking bar from the outside of the processing chamber.
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