发明名称 |
Heat dissipation device for LED chips |
摘要 |
A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.
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申请公布号 |
US7982225(B2) |
申请公布日期 |
2011.07.19 |
申请号 |
US20070964836 |
申请日期 |
2007.12.27 |
申请人 |
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
LAI CHENG-TIEN;ZHOU ZHI-YONG;DING QIAO-LI |
分类号 |
H01L33/00;F28F7/00 |
主分类号 |
H01L33/00 |
代理机构 |
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主权项 |
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地址 |
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