METAL PCB STRUCTURE FOR RADIANT HEAT IMPROVEMENT AND CIRCUIT PROTECTION OF LED LIGHTING DEVICE

摘要

PURPOSE: A metal substrate structure for improving the heat dissipation of an LED lighting application and circuit protection is provided to improve heat emitting characteristics and dielectric strength by improving a laminating structure of the metal equation substrate equipped with the LED. CONSTITUTION: An aluminum substrate(10) is used as a base substrate for the installation of the LED point source of light(18). A first epoxy(12) performs thermal emission and adhesion roles laminated on the aluminum substrate. A metal substrate(14) accelerates the thermal emission spreading from the LED point source of light to the surface light source. The metal substrate performs the roles of a heat radiation path and dummy ground role. The second epoxy(16) bonds the LED point source of light laminated on the metal substrate.