发明名称 |
Copper plating connection for multi-die stack in substrate package |
摘要 |
An embodiment of the present invention is a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package. The dice are positioned one on top of another and have copper plated segments for die interconnection. The dice are interconnected using copper plating to connect the copper plated segments.
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申请公布号 |
US7981726(B2) |
申请公布日期 |
2011.07.19 |
申请号 |
US20050301606 |
申请日期 |
2005.12.12 |
申请人 |
INTEL CORPORATION |
发明人 |
TANG JOHN J.;XU HENRY;LI JIANMIN;ZENG XIANG YIN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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