发明名称 Flex-rigid wiring board and method of manufacturing the same
摘要 A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.
申请公布号 US7982135(B2) 申请公布日期 2011.07.19
申请号 US20070927144 申请日期 2007.10.29
申请人 IBIDEN CO., LTD. 发明人 TAKAHASHI MICHIMASA;AOYAMA MASAKAZU
分类号 H05K1/00 主分类号 H05K1/00
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