Interconnection architecture for multilayer circuits

摘要

An interconnection architecture for multilayer circuits includes an array of vias and a CMOS layer configured to selectively access the array of vias according to an address. The interconnection architecture also includes a crossbar stack which includes layers of intersecting wire segments with programmable crosspoint devices interposed between intersecting wire segments. The vias are connected to the wire segments such that each programmable crosspoint device is uniquely addressed and every address within a contiguous address space accesses a programmable crosspoint device.