| 摘要 |
An insulating layer can be prevented from peeling off with time. A method for manufacturing a printed wiring board is characterized in that, before a metallic substrate (13) provided with an insulating layer (19) is bent, bend grooves (45, 47) with V-shaped cross-sections which divide the insulating layer (19) are provided in portions (41, 43) corresponding to bends (15, 16), abutting grooves (49, 51) with V-shaped cross-sections are provided in the portions (41, 43) corresponding to the bends (15, 16) in the rear surface (17) with no insulating layer (19) of the metallic substrate (13), and the bend angles of the bends (15, 16) are determined by bending the metallic substrate (13) using the bend grooves (45, 47) and the abutting grooves (49, 51) as starting points, and by causing surfaces (35a, 37a) inside the abutting grooves (49, 51) to abut on each other in such a manner that the abutting grooves (49, 51) are closed. |
