发明名称 |
Semiconductor device and its test method |
摘要 |
A second semiconductor chip including the operation of receiving operation instructions given from a first semiconductor chip and outputting a signal corresponding to it is mounted on mounting means. Internal wirings for interconnecting the first and second semiconductor chips, and external terminals respectively connected to the internal wirings are provided in the mounting means to constitute a multi chip module. Further, a signal path for selectively invalidating operation instructions from the first semiconductor chip to the second semiconductor chip is provided inside the module.
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申请公布号 |
US7982217(B2) |
申请公布日期 |
2011.07.19 |
申请号 |
US20080153746 |
申请日期 |
2008.05.23 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
SUGITA NORIHIKO;ISHIGURO TETSUO;YASHIKI NAOKI |
分类号 |
H01L21/66;G01R31/319 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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