SYSTEM AND METHOD FOR POLYURETHANE BONDING DURING AND AFTER OVERMOLDING
摘要
An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.
申请公布号
CA2728300(A1)
申请公布日期
2011.07.18
申请号
CA20112728300
申请日期
2011.01.17
申请人
GROTE INDUSTRIES, INC.
发明人
CORTES ROQUE, MIGUEL OMAR;GARCIA CARDONA, ROBERTO CARLOS;LOA ALMAGUER, ALONSO;DOBROW, ROBERT HUGH;ALVARADO, HECTOR ELOY MENDOZA;HAROS HERNANDEZ, ALFREDO;MORALES, ANTONIO LEAL