| 摘要 |
PURPOSE: A side emitting type light emitting device package and a backlight module are provided to enhance stability while they are miniaturized. CONSTITUTION: A lead frame(10) includes at least one lead. A reflecting part(50) is combined to the lead frame. A light emitting device(20) receives an electric signal and radiates a light. The light emitting device is made of compound semiconductor diodes. The light emitting device is arranged on the lead frame. The reflecting part restricts an opening to a direction in which the light generated in the light emitting device is to be radiated. A molding material has the reflecting body on one side.
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