EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, NOVEL PHENOL RESIN, AND NOVEL EPOXY RESIN

摘要

AN EPOXY RESIN COMPOSITION CAPABLE OF REALIZING LOW DIELECTRIC CONSTANT AND LOW DIELECTRIC DISSIPATION.FACTOR, WHICH IS SUITED FOR USE AS A LATEST CURRENT HIGH-FREQUENCY TYPE ELECTRONIC COMPONENT-RELATED MATERIAL, WITHOUT DETERIORATING HEAT RESISTANCE DURING THE CURING REACTIAN IS PROVIDED. A PHENOL RESIN, WHICH HAS THE RESPECTIVE STRUCTURAL UNITS OF A PHENOLIC HYDROXYL GROUP-CONTAINING AROMATIC HYDROCARBON GROUP (P) DERIVED FROM PHENOLS, AN ALKOXY GROUP- CONTAINING CONDENSED POLYCYCLIC AROMATIC HYDROCARBON GROUP (B) DERIVED FROM METHOXYNAPHTHALENE AND A DIVALENT HYDROCARBON GROUP (X) SUCH AS METHYLENE AND ALSO HAS A STRUCTURE REPRESENTED BY -P-B-X- WHEREIN P, B AND X ARE STRUCTURAL SITES OF THESE GROUPS IN A MOLECULAR STRUCTUZE, IS USED AS A CURING AGENT FOR EPOXY RESIN, OR A PHENOL RESIN AS AN EPOXY RESIN MATERIAL.