发明名称 |
BOARD ARRAY AND MANUFACTURING METHOD OF CAMERA MODULE THEREOF |
摘要 |
PURPOSE: A substrate array and manufacturing method of a camera module using the same are provided to prevent a case in which a coupling groove, which is connected with a boss, is cut. CONSTITUTION: A coupling groove(120) is formed in a unit board(110). The coupling groove is formed by corresponding to the location of a boss. A bridge(130) is contiguous to a bonding groove. The bridge is formed in the external side of the unit board. A cutting part(140) is formed in one end of the bridge. The cutting part is separated with the bonding groove.
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申请公布号 |
KR101049466(B1) |
申请公布日期 |
2011.07.15 |
申请号 |
KR20100050068 |
申请日期 |
2010.05.28 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SEOK, JIN SU;LEE, SANG YEUN;KIM, CHANG HYUP |
分类号 |
H04N5/225 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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