发明名称 BOARD ARRAY AND MANUFACTURING METHOD OF CAMERA MODULE THEREOF
摘要 PURPOSE: A substrate array and manufacturing method of a camera module using the same are provided to prevent a case in which a coupling groove, which is connected with a boss, is cut. CONSTITUTION: A coupling groove(120) is formed in a unit board(110). The coupling groove is formed by corresponding to the location of a boss. A bridge(130) is contiguous to a bonding groove. The bridge is formed in the external side of the unit board. A cutting part(140) is formed in one end of the bridge. The cutting part is separated with the bonding groove.
申请公布号 KR101049466(B1) 申请公布日期 2011.07.15
申请号 KR20100050068 申请日期 2010.05.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SEOK, JIN SU;LEE, SANG YEUN;KIM, CHANG HYUP
分类号 H04N5/225 主分类号 H04N5/225
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