发明名称 ISOLIERTES METALLSUBSTRAT MIT EINEM METALLENEN IMPLANTAT
摘要 <p>The insulated metal substrate (1) has a metal substrate (12) and an insulation layer (11) with electrical webs which is arranged on the upper side of the metal substrate. An electrical component (2) is provided, which is connected to the electrical webs. The metal substrate is provided with a recess, in which a metallic or insulated implant (124) made of ceramic material, particularly aluminum oxide, beryllium oxide, aluminum nitride or aluminum silicon carbide is inserted, whose dimensions corresponds to the recess.</p>
申请公布号 AT516692(T) 申请公布日期 2011.07.15
申请号 AT20080152756T 申请日期 2008.03.14
申请人 ASETRONICS AG 发明人 PILLER, HUGO
分类号 H05K1/05;H01L25/075;H01L25/16;H01L33/00;H05K1/18 主分类号 H05K1/05
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