发明名称 SHEET TO FORM A PROTECTIVE FILM FOR CHIPS AND PROCESS FOR PRODUCING SEMICONDUCTOR CHIPS
摘要 <p>THE PRESENT INVENTION PROVIDES A SHEET TO FORM A PROTECTIVE FILM FOR CHIPS, WHICH CAN BE READILY FORMED INTO A HIGHLY UNIFORM PROTECTIVE FILM ON A BACK SURFACE OF CHIP, AND WHICH, EVEN IF MINUTE SCRATCHES ARE FORMED ON THE BACK SURFACE OF CHIP AS A RESULT OF MECHANICAL GRINDING, CAN ELIMINATE ADVERSE EFFECTS RESULTING FROM THE SCRATCHES.@THE SHEET TO FROM A PROTECTIVE FILM FOR CHIPS OF THE PRESENT INVENTION COMPRISES A RELEASE SHEET AND A PROTECTIVE FILM FORMING LAYER FORMED ON A DETACHABLE SURFACE OF THE RELEASE SHEET, WHEREIN SAID PROTECTIVE FILM FORMING LAYER COMPRISES A THERMOSETTING OR ENERGY RAY-CURABLE COMPONENT AND A BINDER POLYMER COMPONENT.</p>
申请公布号 MY143879(A) 申请公布日期 2011.07.15
申请号 MY2007PI00244 申请日期 2002.03.18
申请人 LINTEC CORPORATION 发明人 HIDEO SENOO;TAKASHI SUGINO;OSAMU YAMAZAKI
分类号 C09J7/00;H01L21/68;C09J133/00;C09J163/00;H01L21/301;H01L21/58;H01L21/78;H01L23/00;H01L23/31;H01L23/48 主分类号 C09J7/00
代理机构 代理人
主权项
地址