VORRICHTUNG UND VERFAHREN ZUR VEREINZELUNG VON SCHEIBENFÖRMIGEN SUBSTRATEN UNTER NUTZUNG VON ADHÄSIONSKRÄFTEN

摘要

The present invention relates to a device and a method for dividing up substrates (2) in wafer form (e.g. wafers), which is used in the semiconductor industry, MST (microstructure technology) industry and photovoltaic industry, whereby improved reliability of the process and lower reject rates are accomplished. This object is achieved according to the invention by using adhesion forces that act between the substrates in wafer form and the devices (1) thereby used.