COMPOSITIONS AND METHODS FOR CMP OF LOW-K-DIELECTRIC MATERIALS

摘要

1 5 COMPOSITIONS AND METHODS FOR CMP OF LOW-K DIELECTRIC MATERIALS ABSTPLACT 'ME PRESENT INVENTION PROVIDES A CHEMICAL-MECHANICAL POLISHING (CMP) 5 COMPOSITION SUITABLE FOR POLISHING LOW-K DIELECTRIC MATERIALS. THE COMPOSITION COMPRISES A PARTICULATE ABRASIVE MATERIAL, AT LEAST ONE SILICONE-FREE NONIONIC SURFACTANT COMPRISING A HYDROPHILIC PORTION AND A LIPOPHILIC PORTION, AT LEAST ONE SILICONE-CONTAINING NONIONIC SURFACTANT COMPRISING A HYDROPHILIC PORTION AND A LIPOPHILIC PORTION, AND AN AQUEOUS CARRIER THEREFOR. A CIVIP METHOD FOR POLISHING A LOW-K DIELECTRIC SURFACE UTILIZING THE COMPOSITION 10 IS ALSO DISCLOSED.