UNIT FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

Disclosed are a semiconductor device, i.e., a monolithic unit having improved adhesion and heat dissipation to a cooling body, and a semiconductor device, which is composed of an assembled body of the monolithic units, and is capable of configuring a discretionary circuit at low cost. The monolithic unit (101) is configured of: copper blocks (1, 8); a conductive pattern-attached insulating substrate (6); an IGBT chip (10) and a diode chip (13); a collector terminal pin (15); implant pins (17) firmly adhered to the chips (10, 13) with solder (11, 14); a printed board (16) having the implant pins (17) firmly adhered thereto; an emitter terminal pin (19), and a control terminal pin (20); a collector terminal pin (15); and a resin case (21) which encapsulates the above-mentioned parts. With the copper blocks (1, 8), adhesion and heat dissipation to the cooling body are improved. Furthermore, the discretionary circuit can be configured by combining a plurality of the intrinsic units (101) with inter-unit wiring board.