发明名称 |
COPPER FOIL FOR AN EMBEDDED PATTERN FOR FORMING A MICROCIRCUIT |
摘要 |
Proposed is a copper foil for an embedded pattern, which has no nodule, and which comprises: a copper carrier layer; a barrier layer formed at one surface of the copper carrier layer; and a seed layer formed at a surface of the barrier layer to form a circuit. The barrier layer is a nickel layer or a nickel alloy layer, and the seed layer is a copper layer. The surface of the seed layer has an average roughness Rz of less than 1.5 µm, and Rmax of less than 2.5 µm. |
申请公布号 |
WO2011028004(A3) |
申请公布日期 |
2011.07.14 |
申请号 |
WO2010KR05860 |
申请日期 |
2010.08.31 |
申请人 |
ILJIN COPPER FOIL CO., LTD.;RYU, JONG HO;YANG, CHANG YOL |
发明人 |
RYU, JONG HO;YANG, CHANG YOL |
分类号 |
H05K3/42;H05K3/18 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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