发明名称 COAT/DEVELOPMENT MODULE ACCOMPANYING COMMON DISTRIBUTION
摘要 PROBLEM TO BE SOLVED: To provide an apparatus which distributes fluid in semiconductor substrate processing operation. SOLUTION: The apparatus includes a center fluid distribution bank which has a plurality of distribution nozzles combined to a plurality of fluid sources and a first processing chamber which is positioned on a first side of a center fluid distribution bank. Moreover, the apparatus includes a second processing chamber which is located on a second side of the center fluid distribution bank and a distribution arm which translates between the center fluid distribution bank, the first processing chamber, and the second processing chamber in parallel. The apparatus, further, includes a distribution arm access shutter which is positioned between the first processing chamber and second processing chamber. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011139076(A) 申请公布日期 2011.07.14
申请号 JP20110006873 申请日期 2011.01.17
申请人 SOKUDO CO LTD 发明人 ISHIKAWA TETSUYA;ROBERTS RICK J
分类号 H01L21/027;B05C15/00;H01L21/677;H01L21/683 主分类号 H01L21/027
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