发明名称 Release Strategies for Making Transferable Semiconductor Structures, Devices and Device Components
摘要 Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
申请公布号 US2011171813(A1) 申请公布日期 2011.07.14
申请号 US201113071027 申请日期 2011.03.24
申请人 THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS 发明人 ROGERS JOHN A.;NUZZO RALPH G.;MEITL MATTHEW;KO HEUNG CHO;YOON JONGSEUNG;MENARD ETIENNE;BACA ALFRED J.
分类号 H01L21/30;H01L21/18;H01L21/20 主分类号 H01L21/30
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