发明名称 |
Release Strategies for Making Transferable Semiconductor Structures, Devices and Device Components |
摘要 |
Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
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申请公布号 |
US2011171813(A1) |
申请公布日期 |
2011.07.14 |
申请号 |
US201113071027 |
申请日期 |
2011.03.24 |
申请人 |
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS |
发明人 |
ROGERS JOHN A.;NUZZO RALPH G.;MEITL MATTHEW;KO HEUNG CHO;YOON JONGSEUNG;MENARD ETIENNE;BACA ALFRED J. |
分类号 |
H01L21/30;H01L21/18;H01L21/20 |
主分类号 |
H01L21/30 |
代理机构 |
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主权项 |
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地址 |
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