| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board configured inexpensively, shared by a lamp type light-emitting diode and a surface mounting light-emitting diode, and downsized. <P>SOLUTION: The circuit board has chip type LED solder connection pads 2103a, 2103b that are used for soldering a chip type LED 2102 on the circuit board 2101 and lamp type LED solder connection lands 2203a, 2203b that are used for soldering a lamp type LED 301 on the circuit board 2101 so that it has the same center of emission as that of the chip type LED 2102. The lamp type LED solder connection lands 2203a, 2203b are provided to tilt at a predetermined angle with respect to the chip type LED solder connection pads 2103a, 2103b. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
