METHOD OF MANUFACTURING AN ELECTRONIC PARTS PACKAGING STRUCTURE

摘要

PURPOSE: A method of manufacturing electronic parts packaging structure is provided to improve the reliability of the electronic parts packaging structure by burying in the insulating layer consisting of the same material without the damage of the electronic component. CONSTITUTION: A first uncured resin layer(14) is heated with the stage and transfer head. An electronic component(20) is pressurized with the transfer head to the first uncured resin layer to the low pressure. The pressurized of the electronic component by the transfer head is instituted as the minimum pressure in order to prevent the generation of damage. The heating temperature is instituted as 100-150°C. The first uncured resin layer is fluidized as much as it has the attaching function. The electronic component is adhered temporary without damage on the first uncured resin layer. A second uncured resin layer(16) is formed. The electronic component is laid between the first and the second uncured resin layer. The electronic component is laid in a first dielectric layer(18).