发明名称 |
SYSTEM AND METHOD FOR VIA STRUCTURE MEASUREMENT |
摘要 |
A system for via structure measurement is disclosed. The system comprises a reflectometer, a simulation unit and a comparing unit. The reflectometer is configured to collect a measured diffraction spectrum of at least a via. The simulation unit is configured to provide simulated diffraction spectrums of the at least a via. The comparing unit is configured to determine at least a depth and at least a bottom profile of the at least a via by comparing the collected diffraction spectrum and the simulated diffraction spectrums.
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申请公布号 |
US2011172974(A1) |
申请公布日期 |
2011.07.14 |
申请号 |
US20100725930 |
申请日期 |
2010.03.17 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
KU YI SHA;HSU WEI TE;PANG HSIU LAN;SHYU DEH MING |
分类号 |
G06F17/10;G01R23/16;G06F17/14;G06F19/00 |
主分类号 |
G06F17/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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