摘要 |
<p>The assembly has a metallic carrier (1) including a surface element (2) that is equipped with electronic power elements (3). A lower side of a printed circuit board (4) is fastened to the surface element, and conductive strips (5) are provided with electrical components and/or a connector socket (6) on an upper side of the circuit board. The electronic power elements at a side of the board are soldered or welded with a contacting surface at the surface element. Connections (7) are soldered on or welded at the assigned conductive strips or conductive strip ends of the circuit board. The electronic power elements are selected from a group consisting of a LED, a power semiconductor component, a thyristor, a transistor and a power amplifier. An independent claim is also included for method for manufacturing an electronic assembly.</p> |