FLUX COMPOSITION FOR LEAD-FREE SOLDER AND LEAD-FREE SOLDER PASTE

摘要

A flux composition for a lead-free solder, which has a bromine or chlorine content of 500 to 30000 ppm relative to the total amount of the flux composition and contains a carbon-carbon double bond compound having a specific structure in an amount of 1 to 10 wt% relative to the total amount of the flux composition, wherein the carbon-carbon double bond compound is preferably at least one compound selected from the group consisting of 2-buten-1,4-diol, 2-hepten-1-ol and 5-hexen-1-ol.