| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounting electronic component, in which a printed board and a cover are positioned to be attached and a more stable solder fillet is formed, in soldering the component to a master printed board. SOLUTION: In the surface-mounting electronic component, a wiring pattern formed on a component mounting surface of a printed wiring board is electrically connected to an electrode pattern formed on a rear surface; an electrode recess having a conductive pattern serving as a terminal in soldering to a master printed board and a fitting cut are alternately formed on the side surface of the printed board; a shallow U-shaped cut slightly thinner than the thickness of the printed board is provided, by forming a concave side fitting to the fitting cut on the bottom side of the side surface of the cover; the bottom side contacting the printed board of the side surface of the cover is formed to be thicker than the depth of the electrode recess; and the electrode recess is surrounded by the U-shaped cut. COPYRIGHT: (C)2011,JPO&INPIT
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