SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND CAMERA SYSTEM

摘要

Provided is a semiconductor device that can reduce the effect of noise occurring at a connection portion between both chips, requires no special circuit for communication, and can accordingly reduce the cost, and also provided are a solid-state imaging device and a camera system. The semiconductor device has a first chip (11) and a second chip (12), which are bonded with each other to form a stacked structure. The first chip (11) is mounted with a high withstanding voltage transistor-based circuit and the second chip (12) is mounted with a low withstanding voltage transistor-based circuit having a withstanding voltage lower than the high withstanding voltage transistor-based circuit. The wiring between the first chip and the second chip is connected through via holes formed in the first chip.