发明名称 POLYAMIDE OR POLYIMIDE RESIN COMPOSITIONS THAT CONTAIN PHOSPHINE OXIDE, AND CURED PRODUCTS THEREOF
摘要 <p>A resin composition which comprises (A) a phosphine oxide represented by general formula (1) and (B) a polyamide or polyimide compound obtained by reacting a diamine with a tetrabasic acid dianhydride; and a photosensitive resin composition which comprises the components (A) and (B), and (C) a photosensitizer or (D) a photopolymerization initiator. Cured films made from the compositions exhibit excellent flame retardance, heat resistance, moisture resistance and electrical insulation properties.</p>
申请公布号 WO2011083554(A1) 申请公布日期 2011.07.14
申请号 WO2010JP07568 申请日期 2010.12.27
申请人 NIPPON KAYAKU KABUSHIKI KAISHA;KURIHASHI, TORU;HORIGUCHI, NAOFUMI;OGI, SATOSHI;OBUCHI, KAZUMI 发明人 KURIHASHI, TORU;HORIGUCHI, NAOFUMI;OGI, SATOSHI;OBUCHI, KAZUMI
分类号 C08L79/08;C08K5/5313;G03F7/004;G03F7/023;G03F7/037;H05K3/28 主分类号 C08L79/08
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