发明名称 APPARATUS AND METHOD FOR FORMING FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus and method for forming a film that improve the flexibility in forming a film, while restraining a manufacturing cost. <P>SOLUTION: In the film forming apparatus, film formation is performed by atomic layer deposition by outputting precursor gases 10A and 10B to a base material 20 by a plurality of ALD heads 11A and 11B, while conveying the base material 20 by using a plurality of guide rolls 13 and 14. Each of the ALD heads 11A and 11B is disposed so as to individually face the guide roll 13 so that the precursor gases 10A and 10B are locally output to the base material 20. The amount of the precursor gases 10A and 10B used is more reduced than that used in a related art, and the variety of the usable precursor gases is widened. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011137208(A) 申请公布日期 2011.07.14
申请号 JP20090298104 申请日期 2009.12.28
申请人 SONY CORP 发明人 YO TAKUCHU;KAWANA TAKAHIRO;HONDA HIDETOSHI;ONODERA SEIICHI;JINNO YOHEI
分类号 C23C16/44 主分类号 C23C16/44
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