发明名称 COOLING METHOD OF STRUCTURE, COOLING DEVICE, AND STRUCTURE INCLUDING THE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling method capable of successfully forming a thin film-shaped water screen in a cooled region to which hydrophilicity imparting treatment is applied, and of suppressing water amount used during cooling, a cooling device and a structure including the cooling device. SOLUTION: By applying hydrophilicity imparting treatment to the cooled region 52 on the outer surface of the structure 50, a hydrophilic layer capable of holding the water screen 60 is formed over the entire cooled region 52. By alternately performing discharge of cooling water and stop of the discharge of the cooling water with respect to the cooled region 52 having the hydrophilic layer formed thereon, repeatedly, the thin film-shaped water screen 60 is formed all the time in the entire cooled region 52, and by latent heat accompanying evaporation in the water screen 60, the structure 50 is cooled. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011137630(A) 申请公布日期 2011.07.14
申请号 JP20110036012 申请日期 2011.02.22
申请人 SEKISUI CHEM CO LTD 发明人 TAJIMA YOSUKE
分类号 F24F5/00 主分类号 F24F5/00
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