| 摘要 |
PROBLEM TO BE SOLVED: To provide: a wafer-level lens array capable of preventing failure such as distortion of a substrate and a crack of a lens due to temperature in a reflow stage; a lens module; and an imaging unit. SOLUTION: The wafer-level lens array 3A includes the substrate 31A and a plurality of lenses 30 provided on the substrate 31A. A plurality of through-holes 32, pierced in a thickness direction of the substrate 31A from a first surface S1 to a second surface S2 on an opposite side to the first surface S1, are formed on the substrate 31A. The lens 30 is provided by filling up each of the plurality of through-holes 32 with thermosetting resin. The substrate 31A has heat resistance to a temperature at which the thermosetting resin is thermally cured, and the coefficient of linear expansion of the substrate 31A in the temperature is smaller than that of the thermosetting resin. COPYRIGHT: (C)2011,JPO&INPIT
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