| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicone resin composition that can control generation of bleeding without altering construction method and design. SOLUTION: The silicone resin composition is for adhering a minute electrical equipment system chip having a movable part to a substrate, and includes an one pack addition-type silicone resin that contains an organo polysiloxane having at least one vinyl group in the molecule, organo-hydrogenpolysiloxane having at least one H-Si bond in the molecule and platinum compound, and a porous filler. COPYRIGHT: (C)2011,JPO&INPIT
|
