| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board that reduces manufacturing steps and improves reliability of a product, and also to provide its manufacturing method. <P>SOLUTION: The peripheries of two metal layers 102 are joined to form a sealed area. At least one through hole passing through the sealed area is formed. Two insulating layers 112 are formed on the two metal layers. Two conductive layers 122 are formed on the two insulating layers. Two insulating layers and two conductive layers are laminated on the two metal layers so that the two metal layers mutually joined are embedded in the two insulating layers and the two insulating layers are filled up in the through hole. The sealed area for the two metal layers is separated to form two mutually separated circuit boards. In this way, comparatively thin substrates are handled in the subsequent patterning, electroplating, and other processes. Substrates in the odd layer or in the even layer can be manufactures through this manufacturing method. <P>COPYRIGHT: (C)2011,JPO&INPIT |
