发明名称 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition that has high lithography characteristics and forms a resist pattern with a favorable shape, and a resist pattern forming method. <P>SOLUTION: The positive resist composition contains a base component (A) whose solubility in an alkali developer is increased by the action of an acid and an acid generator component (B) which generates an acid by exposure. The base component (A) includes a polymeric compound (A1) having a core formed of a polymer where molecular weight is 500 or larger and 20,000 or smaller and at least one arm bonded to the core. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011138003(A) 申请公布日期 2011.07.14
申请号 JP20090297959 申请日期 2009.12.28
申请人 TOKYO OHKA KOGYO CO LTD 发明人 IWASHITA ATSUSHI;YOSHIZAWA SACHIKO;KONNO TAKEMICHI
分类号 G03F7/039;C08F8/00;C08G81/02;H01L21/027 主分类号 G03F7/039
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