| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for disposing a device improving resistance against fluctuation of an electromagnetic field caused by a drive current of a thermoelectric cooling device in relation to a sensitive device on a substrate arranged on the thermoelectric cooling device (TEC). SOLUTION: The structure for disposing the device includes: a substrate 11 for mounting the device 12; the thermoelectric cooling device 1 having a low-temperature part 3 and a high-temperature part driven by the drive current, wherein the substrate 11 is mounted on the low-temperature part 3; and a shield 13 arranged on the substrate 11 between the device 12 and the thermoelectric cooling device 1 and preventing potential fluctuation on the device 12 caused by the drive current of the thermoelectric cooling device 1. COPYRIGHT: (C)2011,JPO&INPIT |
