| 摘要 |
PROBLEM TO BE SOLVED: To perform precise inspection by shortening an electric path between an electrode on the rear surface of a substrate and a tester when inspecting a semiconductor device equipped with an electrode on both surfaces of the substrate (for example, a power semiconductor device) in wafer state. SOLUTION: A chuck lead plate 54 is so provided as to face a support surface 56 of a chuck top 49. A pogo pin 60 is secured at the peripheral part of the chuck top 49. The pogo pin 60 contacts the chuck lead plate 54. A probe 20 contacts an electrode on the surface of a wafer 18. The probe 20 is connected to a tester 22 by way of a cable 47. The electrode on the rear surface of the wafer 18 contacts the support surface 56 of the chuck top 49. The support surface 56 is connected to the tester 22 by way of the chuck top 49, the pogo pin 60, the chuck lead plate 54, and an cable 55. COPYRIGHT: (C)2011,JPO&INPIT
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