| 摘要 |
The invention relates to a device for machining a surface (1), particularly of a space, contaminated by temperature-sensitive contaminants, particularly materials comprising PCBs, wherein the device comprises a high-powered laser beam machining device (2), particularly having a power of about 5 to about 20 kW, particularly in combination with a robot and/or a manipulator set up with prescribed working values, particularly the laser power and/or laser wavelength, adapted to each machining type, so that the temperature-sensitive contaminants are converted into substantially non-hazardous products of decomposition by reaching or exceeding a prescribed temperature limit at a machining location of the surface (1). |
