发明名称 LEAD FRAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a lead frame which suppresses occurrence of cracks when being bent and exhibits superior adhesion to a mold resin. <P>SOLUTION: In a lead frame in which a noble metal-plated layer 13 is formed on the surface of a raw material metal 10 via an Ni-plated substrate layer, the surface roughness Ra of the Ni-plated substrate layer is within the range of 0.1 to 0.8μm. The noble metal-plated layer 13 is formed on the surface of the Ni-plated substrate layer by a flash plating in conformity to the angular or aciculate rough profile of the surface of the Ni-plated substrate layer. In that regard, the noble metal of the plated layer 13 is at least one of Pd, Au and Ag. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011137244(A) 申请公布日期 2011.07.14
申请号 JP20110087575 申请日期 2011.04.11
申请人 MITSUI HIGH TEC INC 发明人 RI AKIRA;YAMAURA DAIGO
分类号 C25D5/12;C25D7/00;H01L23/50 主分类号 C25D5/12
代理机构 代理人
主权项
地址