发明名称 |
CUTTING BLADE CLEANING DEVICE, HALF-CUTTING DEVICE OF FILM LAMINATED BODY, AND CUTTING BLADE CLEANING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a cutting blade cleaning device contributing to the shortening of tact time, when half-cutting a film laminated body. SOLUTION: This cutting blade cleaning device 3 is used for cleaning a cutting blade 4 cutting a polarizing film and an adhesive layer in the film laminated body 2 containing at least the polarizing film, the adhesive layer and a protective film. The cutting blade cleaning device 3 includes a porous cleaning part 9 capable of absorbing organic solvent, a holding part 10 holding the cleaning part 9 and a storing part 11 storing a part of the cleaning part 9 and the organic solvent. The porous cleaning part 9 can be cut by the cutting blade 4. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011136400(A) |
申请公布日期 |
2011.07.14 |
申请号 |
JP20090298436 |
申请日期 |
2009.12.28 |
申请人 |
SUMITOMO CHEMICAL CO LTD |
发明人 |
KISHIZAKI KAZUNORI;UEDA KOJI |
分类号 |
B26D7/18;B26D3/00;B26D3/08 |
主分类号 |
B26D7/18 |
代理机构 |
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代理人 |
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主权项 |
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