发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A method of manufacturing a semiconductor device includes forming a first insulating film over an underlying film by plasma polymerization of cyclic siloxane, and forming a second insulating film on the first insulating film by plasma polymerization of the cyclic siloxane continuously, after forming the first insulating film. The deposition rate of the first insulating film is slower than the deposition rate of the second insulating film.
申请公布号 US2011171775(A1) 申请公布日期 2011.07.14
申请号 US201113006034 申请日期 2011.01.13
申请人 RENESAS ELECTRONICS CORPORATION 发明人 YAMAMOTO HIRONORI;HAYASHI YOSHIHIRO;KAWAHARA JUN;USAMI TATSUYA;OHTO KOICHI
分类号 H01L51/40 主分类号 H01L51/40
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