| 摘要 |
The micro-electromechanical semiconductor component is provided with a first semiconductor substrate (1), which has an upper face, and a second semiconductor substrate (5), which has an upper face. Both semiconductor substrates (1, 5) are bonded resting on the upper faces thereof. A cavity (4) is introduced into the upper face of at least one of the two semiconductor substrates (1, 5). The cavity (4) is defined by lateral walls (3) and opposing ceiling and floor walls, which are formed by the two semiconductor substrates (1, 5). The ceiling or the floor wall acts as a reversibly deformable membrane and an opening (98) extending through the respective semiconductor substrate (1, 5) is arranged in the other of said two walls of the cavity (4). |
