Device for thermal connecting of electronic and/or mechanical components on a first side of a substrate, comprises a substrate holding device and/or a substrate transport unit and/or an energy source for transmitting and aligning radiation

摘要

The device for thermal connecting of electronic and/or mechanical components on a first side of a substrate (2), comprises a substrate holding device and/or a substrate transport unit and/or an energy source (6) for transmitting and aligning radiation or an energy pulse on a placeable fuel between each component and a first side (3) of the substrate. The energy source is movably arranged on a second side (4) turned away to the components of the substrate to arrange the radiation or the energy pulse on the second side turned away second to the components of the substrate. The device for thermal connecting of electronic and/or mechanical components on a first side of a substrate (2), comprises a substrate holding device and/or a substrate transport unit and/or an energy source (6) for transmitting and aligning radiation or an energy pulse on a placeable fuel between each component and a first side (3) of the substrate. The energy source is movably arranged on a second side (4) turned away to the components of the substrate to arrange the radiation or the energy pulse on the second side turned away second to the components of the substrate or a deflector element is movably arranged on the second side turned away to the components of the substrate, where a deflection element (9) is coupled with the energy source to arrange the radiation transmitted by the energy source or the energy pulse transmitted by the energy source on the second side turned away to the components of the substrate. The energy source or the deflection element is arranged on two-dimensional movable layer set, which is arranged below the substrate held on the substrate holding device and/or the substrate transport unit. The energy source is a laser source for transmitting laser beams and the deflection element comprises deflecting optics for aligning the laser beams. The deflecting optics is connected for receiving the laser beams over a flexible optical fiber with the laser source. A collimator is provided for producing parallel laser beam course, and is fixed at the end of the flexible optical fiber directly before the deflecting optics. A holding device such as a pipette is provided for positioning and holding the components. Independent claims are included for: (1) a placement machine for assembling of electronic and/or mechanical components; and (2) a soldering method for thermal connecting of electronic and/or mechanical components.