发明名称 INTELLIGENT CONTROL SYSTEM FOR ELECTROCHEMICAL PLATING PROCESS
摘要 <p>A method and system are disclosed for controlling plating bath compositions. Speciation analyzers including HPLC and mass spectrometry are employed to separate, detect, identify, and quantify additives and degradation products. A control unit is linked to a plating bath interface, analyzer interface, and valves to control the flow of plating bath to an analyzer sampler and back to plating bath. For each degradation product, a response output is determined for at least one performance factor in terms of an additive equivalent amount that produces the same effect. A data processing unit receives concentration data for additives and degradation products from speciation analyzers and calculates an amount of each additive needed to replenish a used bath. As a result, the bleed-and-feed ratio for maintaining plating baths can be substantially reduced with significant productivity improvement and cost savings in terms of chemicals, chemical disposal, less down time and improved product quality.</p>
申请公布号 WO2011084877(A1) 申请公布日期 2011.07.14
申请号 WO2011US00005 申请日期 2011.01.04
申请人 BZ PLATING PROCESS SOLUTION;ZHOU, BOLI 发明人 ZHOU, BOLI
分类号 C25D5/56 主分类号 C25D5/56
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