发明名称 ELECTROMAGNETIC BANDGAP STRUCTURE AND CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electromagnetic bandgap structure for shielding the noise of a specific frequency band. <P>SOLUTION: An electromagnetic bandgap structure includes a plurality of conductive plates located on a first horizontal surface and a stitching via part for electrically connecting two conductive plates for each two conductive plates among a plurality of conductive plates. The stitching via part includes a first via with one end connected to one of the two conductive plates, a second via with one end connected to the other of the two conductive plates, a spiral connection for forming a spiral series connection structure on at least one vertical plane orthogonal to the first horizontal surface, a first conductive connection pattern for connecting one end of the spiral connection and the other end of the first via, and a second conductive connection pattern for connecting the other end of the spiral connection and the other end of the second via. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011139016(A) 申请公布日期 2011.07.14
申请号 JP20100151966 申请日期 2010.07.02
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK DAE-HYUN;KIM HAN;KANG MYUNG-SAM
分类号 H05K3/46;H05K9/00 主分类号 H05K3/46
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