| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus that can secure an evacuation place for a wafer before/after processing without enlarging and complicating a mechanism of a transfer chamber, and can also detect the position of a wafer newly conveyed into the transfer chamber in a state that a wafer is put in the wafer evacuation place. SOLUTION: The vacuum processing apparatus includes a transfer chamber 2 provided between two vacuum chambers so as to transfer a substrate provided with a notch or an orientation flat. The transfer chamber 2 includes lift pins 111-113 for supporting the substrate, a buffer arm 13 for holding the substrate at a temporary placement position, a substrate stage 12 for placing the substrate thereon, and a first sensor 14 for detecting the notch or the orientation flat of the substrate. COPYRIGHT: (C)2011,JPO&INPIT |
