发明名称 PRESSURE MODULE AND DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To solve the problem caused when a fluid is used in a pressure module for pressurizing a wafer, wherein the pressurized fluid leaks from a boundary between a pressure transmission member and another structure suitable for the pressure transmission member. SOLUTION: The pressure module pressurizes an object to be pressurized by controlling a fluid that is taken in/out from/to the outside. The module includes a pressure transmission plate for transmitting the pressurization pressure by the fluid to the object to be pressurized, a base for supporting the pressure transmission plate to form a space between the pressure transmission plate and itself, and a pressure sheet that is interposed so that the fluid may not be directly brought into contact with the pressure transmission plate and transmits the pressurization pressure by the fluid while it is in contact with the pressure transmission plate. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011139005(A) 申请公布日期 2011.07.14
申请号 JP20100000208 申请日期 2010.01.04
申请人 NIKON CORP 发明人 IZUMI SHIGETO
分类号 H01L21/02;B23K20/00;B23K20/02;H01L21/683 主分类号 H01L21/02
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