发明名称 APPARATUS FOR BONDING ACF
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for controlling a tension to be applied to an ACF (anisotropic conductive film) without using a mechanical tension control system when the ACF is bonded to a display substrate or a printed board. SOLUTION: The apparatus 1 for bonding an ACF includes a supply reel 2 on which an ACF tape 110 is wound, and a recovery reel 4 for winding up a base tape 108, and further includes a tension motor 27 and a control unit 37. The tension motor 27 is attached to the supply reel 2, and applies a torque to the supply reel 2 in a direction N opposite to the winding direction M of the recovery roll 4. The control unit 37 controls the torque of the tension motor 27 based on the diameter D of the ACF tape 110 wound on the supply reel 2. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011138041(A) 申请公布日期 2011.07.14
申请号 JP20090298629 申请日期 2009.12.28
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 MORIYA HIDEKI;KAI MINORU;NOMOTO HIDEKI;KANEKO TATSUO
分类号 G09F9/00;G02F1/13;G02F1/1345;H01L21/60;H01L51/50;H05B33/06;H05B33/10;H05K3/32;H05K3/36 主分类号 G09F9/00
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